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| STTH1212 Ultrafast recovery - 1200 V diode Main product characteristics A K IF(AV) VRRM Tj VF (typ) trr (typ) 12 A 1200 V 175 C 1.25 V 50 ns A K TO-220AC STTH1212D Features and benefits Ultrafast, soft recovery Very low conduction and switching losses High frequency and/or high pulsed current operation High reverse voltage capability High junction temperature K A NC D2PAK STTH1212G Description The high quality design of this diode has produced a device with low leakage current, regularly reproducible characteristics and intrinsic ruggedness. These characteristics make it ideal for heavy duty applications that demand long term reliability. Such demanding applications include industrial power supplies, motor control, and similar mission-critical systems that require rectification and freewheeling. These diodes also fit into auxiliary functions such as snubber, bootstrap, and demagnetization applications. The improved performance in low leakage current, and therefore thermal runaway guard band, is an immediate competitive advantage for this device. Order codes Part Number STTH1212D STTH1212G STTH1212G-TR Marking STTH1212D STTH1212G STTH1212G March 2006 Rev 1 www.st.com 1/9 9 Characteristics STTH1212 1 Table 1. Symbol VRRM IF(RMS) IF(AV) IFRM IFSM Tstg Tj Characteristics Absolute ratings (limiting values at 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average forward current, = 0.5 Repetitive peak forward current Surge non repetitive forward current Storage temperature range Maximum operating junction temperature Tc = 130 C tp = 5 s, F = 5 kHz square tp = 10 ms Sinusoidal Value 1200 30 12 160 100 -65 to + 175 175 Unit V A A A A C C Table 2. Thermal parameter Symbol Rth(j-c) Parameter Junction to case Value 1.6 Unit C/W Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM Min. Typ Max. 10 A 7 70 2.2 IF = 12 A 1.30 1.25 2.0 1.9 V Unit VF(2) Forward voltage drop Tj = 125 C Tj = 150 C 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 1.5 x IF(AV) + 0.033 IF2(RMS) 2/9 STTH1212 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C 50 16 2 400 6 ns V Min. Typ Max. 100 ns 70 24 A Unit trr Reverse recovery time IRM S tfr VFP Reverse recovery current Softness factor Forward recovery time Forward recovery voltage IF = 12 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C IF = 12 A, dIF/dt = -200 A/s, VR = 600 V, Tj = 125 C dIF/dt = 50 A/s IF = 12 A VFR = 1.5 x VFmax, Tj = 25 C IF = 12 A, dIF/dt = 50 A/s, Tj = 25 C Figure 1. P(W) 30 Conduction losses versus average current = 0.1 = 0.2 = 0.5 Figure 2. IFM(A) 100 Forward voltage drop versus forward current 25 = 0.05 =1 90 80 70 60 Tj=150C (typical values) 20 15 50 40 Tj=25C (maximum values) Tj=150C (maximum values) 10 30 T 5 20 10 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0.0 0.5 IF(AV)(A) 0 =tp/T tp VFM(V) 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 3/9 Characteristics STTH1212 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Figure 4. Peak reverse recovery current versus dIF/dt (typical values) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 30 40 35 IRM(A) VR=600V Tj=125C IF=2 x IF(AV) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 5 Single pulse 25 IF=0.5 x IF(AV) IF=IF(AV) 20 15 10 tp(s) 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 5. trr(ns) 600 550 500 450 400 350 300 250 200 150 100 0 50 Reverse recovery time versus dIF/dt (typical values) VR=600V Tj=125C IF=2 x IF(AV) Figure 6. Qrr(C) 5.0 4.5 4.0 3.5 VR=600V Tj=125C Reverse recovery charges versus dIF/dt (typical values) IF=2 x IF(AV) IF=IF(AV) IF=0.5 x IF(AV) 3.0 2.5 2.0 1.5 1.0 IF=0.5 x IF(AV) IF=IF(AV) dIF/dt(A/s) 100 150 200 250 300 350 400 450 500 0.5 0.0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 7. Softness factor versus dIF/dt (typical values) Figure 8. Relative variations of dynamic parameters versus junction temperature IF=IF(AV) VR=600V Reference: Tj=125C S factor 4.0 3.5 3.0 2.5 2.0 IF 2xIF(AV) VR=600V Tj=125C 2.25 2.00 1.75 1.50 1.25 1.00 trr S factor 0.75 IRM 1.5 1.0 0.50 0.25 QRR dIF/dt(A/s) 0.5 0 50 100 150 200 250 300 350 400 450 500 Tj(C) 0.00 25 50 75 100 125 4/9 STTH1212 Characteristics Figure 9. VFP(V) 45 40 35 IF=IF(AV) Tj=125C Transient peak forward voltage versus dIF/dt (typical values) Figure 10. Forward recovery time versus dIF/dt (typical values) tfr(ns) 750 700 650 600 IF=IF(AV) VFR=1.5 x VF max. Tj=125C 30 25 20 15 10 550 500 450 400 350 300 5 0 0 100 dIF/dt(A/s) 200 300 400 500 250 200 0 100 dIF/dt(A/s) 200 300 400 500 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25C Figure 12. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, ecu = 35 m) Rth(j-a)(C/W) 80 70 60 100 50 40 30 10 20 10 VR(V) 1 1 10 100 1000 0 0 5 10 15 SCU(cm) 20 25 30 35 40 5/9 Package mechanical data STTH1212 2 Package mechanical data Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.55 Nm (TO-220AC) Maximum torque value: 0.7 Nm (TO-220AC) Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 A C D E F F1 G 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 F1 L9 L4 F D H2 L2 L4 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 M E G L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/9 STTH1212 Table 6. D2PAK dimensions Package mechanical data DIMENSIONS REF. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L V2 M * L2 * FLAT ZONE NO LESS THAN 2mm L3 M R V2 0.40 typ. 0 8 0.016 typ. 0 8 Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information STTH1212 3 Ordering information Part Number STTH1212D STTH1212G STTH1212G-TR Marking STTH1212D STTH1212G STTH1212G Package TO-220AC D PAK D2PAK 2 Weight 1.86 g 1.48 g 1.48 g Base qty 50 50 1000 Delivery mode Tube Tube Tape & reel 4 Revision history Date 02-Mar-2006 Revision 1 First issue. Description of Changes 8/9 STTH1212 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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